Acid Copper Plating Additive for Via-Filling

journal of the japan institute of electronics packaging

Volumn 4, Issue 7, 2004, Pages 629-633

  Matsunami, Takashi ^a   Ito, Tomoko ^a   Iwamoto, Yuka ^a   Yamato, Shigeru ^a  

^a Okuno Chemical Industries Co Ltd   (Japan)

Author keywords

Acid Copper Plating; CVS; Film Property; Leveler; Via Filling

Indexed keywords

EID: 85009643355     PISSN: 13439677     EISSN: 1884121x     Source Type: Journal    
DOI: 10.5104/jiep.4.629     Document Type: Article

References (5)

1. M. Pushpavanam, B. A. Shepol: “Leveling in Electrodeposition”, Electroplating and Metal Finishing, Vol. 29, No. 7/8, pp. 17, 1976.
2. No. 10, pp. 11, 1976.
3. L. Mirkova, St. Rashkov, Chr. Nanev: “The leveling Mechanism during Bright Acid Copper Plating”, Surface Technology, Vol. 15, pp. 181-190, 1982.
4. R. Haak, C. Ogden, D. Tench: “Cyclic Voltammetric Stripping Analysis of Acid Copper Sulfate Plating Baths, Part2”, Plating and Surface Finishing, Vol. 69, No. 3, pp. 62-66, 1982.
5. W. O. Freitag, C. Ogden, D. Tench, J. White: “Determination of the Individual Additive Components in Acid Copper Plating Baths”, Plating and Surface Finishing, Vol. 70, No. 10, pp. 55-60, 1983.