Creep and creep rupture of 63 Sn-37 Pb solder

Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

Volumn 66, Issue 643, 2000, Pages 589-

  Takada, Akio ^a   Sakane, Masao ^a   Tsukada, Yutaka ^a   Nishimura, Hideo ^a  

^a MAIZURU NATIONAL COLLEGE OF TECHNOLOGY   (Japan)

Author keywords

Constitutive equation; Creep; Electronic device; Rupture time; Solder

Indexed keywords

EID: 12244283710     PISSN: 03875008     EISSN: None     Source Type: Journal    
DOI: 10.1299/kikaia.66.589     Document Type: Article

References (0)