Effects of hold-time on thermal fatigue life of solder joints

Nippon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

Volumn 63 A, Issue 611, 1997, Pages 1594-1600

  Mukai, Minoru ^a   Kawakami, Takashi ^a   Takahashi, Kuniaki ^a   Kishimoto, Kikuo ^a   Shibuya, Tosikaz ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; ELASTICITY; ELECTRONIC EQUIPMENT; FATIGUE OF MATERIALS; FATIGUE TESTING; SERVICE LIFE; STRAIN RATE; THERMAL STRESS; TIN ALLOYS;

ELASTIC FOLLOW UP; HOLD TIME; THERMAL FATIGUE LIFE;

SOLDERED JOINTS;

EID: 0031185851     PISSN: 03875008     EISSN: None     Source Type: Journal    
DOI: 10.1299/kikaia.63.1594     Document Type: Article

References (11)