Thermal fatigue reliability assessment for solder bump joint of BGA

Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

Volumn 67, Issue 654, 2001, Pages 216-224

  Yu, Qiang ^a   Kaga, Yasuhisa ^a   Shiratori, Masaki ^a   Kifune, Manabu ^a  

^a YOKOHAMA NATIONAL UNIVERSITY   (Japan)

Author keywords

BGA package; FEM; Inelastic strain range; Statistical Design Support System; Thermal fatigue

Indexed keywords

EID: 12444282935     PISSN: 03875008     EISSN: None     Source Type: Journal    
DOI: 10.1299/kikaia.67.216     Document Type: Article

References (9)

1. Japanese source
2. Yu Q., Shiralori M., and Wang, S. B.", Thermal Condition and Thermal Stress Analysis of Surface-Mount Assembly with a Solder Joint Element", ASME, WAM'94, AMD-Vol. 187, Mechanicals and Materials for Electronic Packaging, Vol. 2, pp. 205-211, (1994.11)
3. Yu Q., Shiratori M.", THERMAL FATIGUE RELIABILITY ASSESSMENT FOR SOLDER JOINTS OF BGA ASSEMBLY", EEP-Vol. 26-l, Advancesin Electronic Packaging 1999, Volumel, ASME, 1999, 239-246
4. Yu, Q. and Shiratori, M., "Fatigue-Strength Prediction of Microelectronics Solder Joints Under Thermal Cyclic Loading", 1997, IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 20, no. 2, pp. 266-273.
5. Japanese source
6. Japanese source
7. Japanese source
8. Japanese source
9. Japanese source