The thermal annealing effect on the residual stress and mechanical property in the compressive stressed DLC film

Materials Science Forum

Volumn 475-479, Issue V, 2005, Pages 3619-3622

  Choi, H W ^a   Moon, M W ^a   Kim, T Y ^a,b   Lee, K R ^b   Oh, K H ^a  

^a Seoul National University   (South Korea)

^b Korea Institute of Science and Technology   (South Korea)

Author keywords

Compressive stress; Diamond Like Carbon; Stress Reduction; Thermal annealing

Indexed keywords

COMPRESSIVE STRESS; ELASTIC MODULI; FILM GROWTH; MULTILAYERS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; RAPID THERMAL ANNEALING; RESIDUAL STRESSES; STRESS RELAXATION; TRIBOLOGY;

DIAMOND LIKE CARBON; REACTION CHAMBERS; STRESS REDUCTION; THERMAL ANNEALING;

DIAMOND LIKE CARBON FILMS;

EID: 17144397231     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/0-87849-960-1.3619     Document Type: Conference Paper

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