Mechanical response of PCB assemblies during infrared reflow soldering

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 1, 1996, Pages 127-132

  Mittal, Sandeep ^b   Masada, Glenn Y ^a,b   Bergman, Theodore L ^b  

^a IEEE

^b The University of Texas at Austin   (United States)

Author keywords

Infrared reflow soldering; Printed circuit board assembly warpage; Solder joint formation

Indexed keywords

DEFORMATION; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); MATHEMATICAL MODELS; SOLDERED JOINTS; SOLDERING; STIFFNESS;

INFRARED REFLOW SOLDERING; WARPAGE;

PRINTED CIRCUIT BOARDS;

EID: 0030106420     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.486624     Document Type: Article

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