Correlation of observed stability and polishing performance to abrasive particle size for CMP

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1999, Pages 362-369

  Palla, B J ^a   Shah, D O ^a  

^a UNIVERSITY OF FLORIDA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; CHEMICAL POLISHING; PARTICLE SIZE ANALYSIS; POTASSIUM COMPOUNDS; SLURRIES; SODIUM COMPOUNDS; SURFACE ACTIVE AGENTS;

CHEMICAL MECHANICAL POLISHING (CMP);

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0033319251     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)