A study on dielectric characteristics of fluorinated polyimide thin film

Journal of Colloid and Interface Science

Volumn 272, Issue 2, 2004, Pages 384-390

  Park, Soo Jin ^a   Cho, Ki Sook ^a   Kim, Sung Hyun ^b  

^a Korea Research Institute of Chemical Technology   (South Korea)

^b Korea University   (South Korea)

Author keywords

Dielectric constant; Fluorination; Mechanical properties; Polyimide; Thermal properties

Indexed keywords

DIELECTRIC MATERIALS; POLYAMIDES; TENSILE STRENGTH; THERMAL EFFECTS; THERMOGRAVIMETRIC ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

DIELECTRIC SPECTROMETRY; FLUORINATION REACTIONS;

THIN FILMS;

FLUORINE DERIVATIVE; POLYIMIDE;

ARTICLE; CONCENTRATION (PARAMETERS); DIELECTRIC CONSTANT; FILM; FLUORINATION; POLARIZATION; PRIORITY JOURNAL; SPECTROMETRY; TENSILE STRENGTH; THERMOGRAVIMETRY; X RAY PHOTOELECTRON SPECTROSCOPY;

CHEMISTRY, PHYSICAL; FLUORINE; IMIDES; MATERIALS TESTING; MEMBRANES, ARTIFICIAL; MOLECULAR STRUCTURE; POLYAMINES; SURFACE PROPERTIES; TEMPERATURE;

EID: 1542604158     PISSN: 00219797     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jcis.2003.12.027     Document Type: Article

References (24)

1. Banerjee S., Madhra M.K., Salunke A.K., Maier G. J. Polym. Sci. A Polym. Chem. 40:2002;1016.
2. Laius L.A. Polyimide: Thermally Stable Polymer. 1987;Consultants Bureau, New York.
3. Liang T., Makita Y., Kimura S. Polymer. 42:2001;4867.
4. Singer P. Changing the Promise of Faster Chips. 1994;Semiconductor International. p. 52.
5. Ghosh M.K., Mittal K.L. Polyimides: Fundamentals and Applications. 1996;Dekker, New York.
6. Madhra M.K., Salunke A.K., Banerjee S., Prabha S. Macromol. Chem. Phys. 9:2002;203.
7. Lee Y.K., Murarka S.P. Mater. Res. Bull. 34:1999;869.
8. Jiang L.Y., Leu C.M., Wei K.H. Adv. Mater. 14:2002;426.
9. Yang C.P., Hsiao S.H., Chen K.H. Polymer. 43:2002;5095.
10. Park S.J. Hsu J.P. Interfacial Forces and Fields: Theory and Applications. 1999;Dekker, New York.
11. Qu W.L., Ko T.M. J. Appl. Polym. Sci. 82:2001;1642.
12. Chen K.Y., Kuo J.F. Macromol. Chem. Phys. 201:2000;2676.
13. Chaiyasu C., Tsuda T., Kitagawa S., Wada H., Monde T., Nakabeya Y. J. Microcolumn Sep. 11:1999;590.
14. Sharts C.M. J. Chem. Educ. 45:1968;185.
15. Park S.J., Kim J.S. J. Colloid Interface Sci. 232:2000;311.
16. Park S.J., Jin J.S. J. Colloid Interface Sci. 236:2001;155.
17. Bessonov M.I., Zubkov V.A. Polyamic Acids and Polyimides: Synthesis, Transformations, and Structure. 1993;CRC Press, Boca Raton, FL.
18. Nansé G., Papirer E., Fioiux P., Mocuet F., Tressaud A. Carbon. 35:1997;515.
19. Alegaonkar P.S., Mandale A.B., Sainkar S.R., Bhoraskar V.N. Nucl. Instrum. Methods Phys. Res. Sect. B Beam Interact. Mater. Atoms. 194:2002;281.
20. Grahan Solomons T.W., Fryhle C.B. Organic Chemistry. seventh ed. 2001;Wiley, New York.
21. Sen K.D., Jorgensen C.K. Electronegativity. 1987;Springer-Verlag, New York.
22. Park S.J., Kim H.C. J. Polym. Sci. B Polym. Phys. 39:2001;121.
23. Chern Y.T., Shine H.C. Macromol. Chem. Phys. 199:1998;963.
24. Hippel. Dielectric Materials and Applications. 1954;Artech House.