Failure Analysis of Flip Chip Bumps after Thermal Stressing

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2000, Pages 41-48

  Hooghan, Tejpal K ^a   Hooghan, Kultaransingh ^a   Nakahara, Sho ^a   Wolf, Robert K ^a   Privette, Robert W ^a   Moyer, Ralph S ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; MICROSTRUCTURE; PASSIVATION; POLISHING; POROSITY; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SPUTTERING; THERMAL EXPANSION; THERMAL STRESS; TRANSMISSION ELECTRON MICROSCOPY;

FLIP CHIP BUMPS; MICROSTRUCTURAL ANALYSIS; SCANNING ACOUSTIC MICROSCOPY (SAM);

FAILURE ANALYSIS;

EID: 1542360660     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

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4. Michael J. Sullivan, Mat. Res. Soc. Symp. Proc., 515, 55-66 (1998)
5. Don Werder, Lucent Technologies, personal communications