Assessment of flip chip interconnect integrity using scanning acoustic microscopy

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 633-640

  Wolf, Robert K ^a   Hooghan, Tejpal K ^a   Bachman, Mark A ^a   Weachock, Ronald J ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC IMAGING; NONDESTRUCTIVE EXAMINATION; RELIABILITY; SOLDERED JOINTS; STRESSES; THERMAL DIFFUSION;

FLIP CHIP JOINT; FLIP CHIP SOLDER INTERCONNECT; HIGH TEMPERATURE STORAGE; SCANNING ACOUSTIC MICROSCOPY;

FLIP CHIP DEVICES;

EID: 0034483004     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (15)