A Methodology to Reduce Ion Beam Induced Damage in TEM Specimens Prepared by FIB

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2002, Pages 313-316

  Liu, Chin Kai ^a   Chen, Chi Jen ^a   Chiou, Jeh Yan ^a   Su, David ^a  

^a Taiwan Semiconduct Manufacture CL   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CRYSTAL ORIENTATION; FAILURE ANALYSIS; INTEGRATED CIRCUITS; ION BOMBARDMENT; OXIDATION; SEMICONDUCTING SILICON; SILICON WAFERS; STRUCTURAL ANALYSIS; THICKNESS MEASUREMENT; TRANSMISSION ELECTRON MICROSCOPY;

DEFECT DIAGNOSIS; ION MILLING; SPIN ON GLASS (SOG);

ION BEAMS;

EID: 1542360101     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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