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Volumn , Issue , 2000, Pages 285-291

Time Domain Reflectometry as a Device Packaging Level Failure Analysis and Failure Localization Tool

Author keywords

[No Author keywords available]

Indexed keywords

ATTENUATION; CAPACITANCE; CATHODE RAY OSCILLOSCOPES; COMPUTER AIDED DESIGN; ELECTRIC IMPEDANCE; FAILURE ANALYSIS; REFLECTOMETERS; SCANNING ELECTRON MICROSCOPY; USER INTERFACES; WAVEFORM ANALYSIS;

EID: 1542300825     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (8)

References (10)
  • 1
    • 1542373429 scopus 로고    scopus 로고
    • Parameter Extraction and Electrical Characterization of High Density Connector Using Time Domain Measurements
    • February
    • S. Pannala, A. Haridass, M. Swaminathan, "Parameter Extraction and Electrical Characterization of High Density Connector Using Time Domain Measurements", IEEE Transactions On Advanced Packaging, Vol. 22, No. 1, February 1999
    • (1999) IEEE Transactions on Advanced Packaging , vol.22 , Issue.1
    • Pannala, S.1    Haridass, A.2    Swaminathan, M.3
  • 3
    • 0026821075 scopus 로고
    • Measuring Controlled-Impedance Boards with TDR
    • February
    • M.D. Tilden, "Measuring Controlled-Impedance Boards with TDR," Printer Circuit Fabrication, February 1992
    • (1992) Printer Circuit Fabrication
    • Tilden, M.D.1
  • 4
    • 0030085334 scopus 로고    scopus 로고
    • Time-Domain Characterization and Circuit Modelling of a Multilayer Ceramic Package
    • February
    • J.M. Jong, B. Jako, V.K. Tripathi, "Time-Domain Characterization and Circuit Modelling of a Multilayer Ceramic Package," IEEE Transactions of CPMT, Part B, Vol. 19, No. 1, February 1996, pp48-55
    • (1996) IEEE Transactions of CPMT, Part B , vol.19 , Issue.1 , pp. 48-55
    • Jong, J.M.1    Jako, B.2    Tripathi, V.K.3
  • 5
    • 1542314500 scopus 로고
    • TDR tools in Modeling Interconnects Packages
    • "TDR tools in Modeling Interconnects and Packages," - Tektronix Application Note, 1993
    • (1993) Tektronix Application Note
  • 6
    • 0030126782 scopus 로고    scopus 로고
    • Measuring Parasitic Capacitance and Inductance Using TDR
    • April
    • Dascher, D. "Measuring Parasitic Capacitance and Inductance Using TDR." Hewlett Packard Journal, April 1996, pp. 83-96.
    • (1996) Hewlett Packard Journal , pp. 83-96
    • Dascher, D.1
  • 8
    • 1542270931 scopus 로고    scopus 로고
    • Comparative TDR Analysis as a Packaging FA Tool
    • November
    • Odegard, C., C. Lambert. "Comparative TDR Analysis as a Packaging FA Tool." ISTFA Proceedings. November 1999.
    • (1999) ISTFA Proceedings
    • Odegard, C.1    Lambert, C.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.