Comparative TDR Analysis as a Packaging FA Tool

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 1999, Pages 49-55

  Odegard, Charles ^a   Lambert, Craig ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SCANNING ACOUSTIC MICROSCOPY (SAM); TIME DOMAIN REFLECTOMETRY (TDR);

ACOUSTIC MICROSCOPES; ELECTRIC FAULT LOCATION; ELECTRIC LINES; FAILURE ANALYSIS; INTEGRATED CIRCUITS; REFLECTOMETERS; SEMICONDUCTOR DEVICE MANUFACTURE; SHORT CIRCUIT CURRENTS; SIGNAL PROCESSING; TIME DOMAIN ANALYSIS; WAVEFORM ANALYSIS;

ELECTRONICS PACKAGING;

EID: 1542270931     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

1. Package Analysis: SAM and X-Ray, T.M. Moore and C. Hartfield, in Failure Analysis of Integrated Circuits, Tools and Techniques, L.C. Wagner, ed., Kluwer Academic Publishers, Boston (1999).
2. Acoustic Microscopy (C-AM), T.M. Moore, in Characterization of Integrated Circuit Packaging Materials, T.M. Moore and R.G. Kenna, eds., Butterworth-Heinemann, Boston (1993).
3. X-Ray Radiographic Inspection, J. Colangelo, ibid.
4. 4, Digital Sampling Oscilloscope User Manual, Tektronix Model 11801C.
5. TDR Tools in Modeling Interconects and Packages, Tektronix Application Note.
6. Time Domain Reflectometry Theory, Hewlett Packard Application Note 1304-2.
7. Measurement and location of dielectric anomalies in field aged XLPE cables, Y.P. Aksenov, V. Arsentiev. M. Golovkov; Y.S. Pintal, J.C. Bromley, A. Glodjo, and W. McDermid, Conference Record of the 1994 IEEE International Symposium on Electrical Insulation IEEE, New York, (1994) p. 89-94.
8. No small change (compact time-domain reflectometers), W.R. Campbell, Telephone-Engineer-and-Management. vol.94, no.23 (1990) p.54-6.
9. Using The Time Domain Reflectometer To Check For And Locate A Fault, M. Ramphai, E. Sadok-E, Third International Conference on CANDU Maintenance Proceedings. Canadian Nucl. Soc, Toronto, Ont., Canada (1997) p.1-5.
10. An Automatic Fault Detection And Location Technique In Low Voltage Distribution Networks, S. Navaneethan, J.J. Soraghan, W.H. Siew, R. Muirhead, and J. Livie, Proceedings of EMPD '98. 1998 International Conference on Energy Management and Power Delivery, IEEE, New York (1998) p.732-6 vol.2
11. Theoretical Background for the TDR Methodology, H.H. Nissen and P. Moldrup Proceedings of the Symposium: Time Domain Reflectometry Applications in Soil Science, Tjele, Denmark: Danish Institute of Plant and Soil Science (1994) pp. 9-23. SP report no. 11,Volume 3
12. Electrical Evaluation of the BIPS-0 Package, Patrick D. Boyle, Digital (WPL) Technical Note TN-29, Palo Alto CA, July 1992.
13. Characterization and modeling of packages by a time-domain reflectometry approach, Van Hauwermeiren, L.; Herreman, M.; Botte, M.; De Zutter, D. Components, Hybrids, and Manufacturing Technology, IEEE Transactions 478-482 Aug. 1992 Vol. 15 Issue:
14. Mission reliability improvement by marginal checking, Boenning-R-A, Proceedings-of-the-Annual-Reh'abihty-and-Maintainability-Symposium, Piscataway, NJ, USA. (1990) p 53-58
15. th Edition, Bill Blood, Motorola U.S.A. (1988) p. 48.