SCOPUS 정보 검색 플랫폼

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2000, Pages 415-421

Specific Area Planar and Cross-Sectional Lift-Out Techniques: Procedures and Novel Applications

(6) Rai, Raghaw a Subramanian, Swaminathan b Rose, Stewart a Conner, James a Schani, Phil b Moss, Jamey b

a MOTOROLA INC (United States)

b Freescale Semiconductor (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; ELECTRONS; ENERGY DISPERSIVE SPECTROSCOPY; FAILURE ANALYSIS; GLUING; HIGH RESOLUTION ELECTRON MICROSCOPY; IMAGE ANALYSIS; SILICA; TRANSMISSION ELECTRON MICROSCOPY;

CROSS-SECTIONAL LIFT OUT TECHNIQUES; FOCUSED ION BEAM (FIB);

ION BEAMS;

EID: 1542300780 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (16)

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