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Volumn 480, Issue , 1997, Pages 187-192
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Combined tripod polishing and FIB method for preparing semiconductor plan view specimens
a a
a
IBM
(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
ION BEAMS;
POLISHING;
SPECIMEN PREPARATION;
TRANSMISSION ELECTRON MICROSCOPY;
FOCUSED ION BEAM (FIB) METHOD;
SEMICONDUCTOR PLAN VIEW SPECIMENS;
TRIPOD POLISHING;
SEMICONDUCTOR DEVICE MANUFACTURE;
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EID: 0031385978
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-480-187 Document Type: Conference Paper |
Times cited : (32)
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References (4)
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