Silicon-substrate Intracortical Microelectrode Arrays with Integrated Electronics for Chronic Cortical Recording

Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings

Volumn 3, Issue , 2003, Pages 2164-2167

  Vetter, R J ^a   Olsson III, R H ^a   Hetke, J F ^a   Williams, J C ^a,b   Pellinen, D ^a   Wise, K D ^a   Kipke, D R ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

^b UNIVERSITY OF WISCONSIN MADISON   (United States)

Author keywords

Electrode; Multichannel; Neuroprosthesis; Polymide; Pre amplifier; Silicon

Indexed keywords

BRAIN; MICROELECTRONICS; POLYIMIDES; SIGNAL PROCESSING; SILICON; SUBSTRATES; THIN FILMS;

CHRONIC CORTICAL RECORDING; MICROELECTRODE ARRAYS;

BIOMEDICAL ENGINEERING;

EID: 1542271327     PISSN: 05891019     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. Williams, J.C., R.L. Rennaker, and D.R. Kipke, Long-term neural recording characteristics of win microelectrode arrays implanted in cerebral cortex. Brain Res Brain Res Protoc, 1999. 4(3): p. 303-13.
2. Drake, K.L., et al., Performance of planar multisite microprobes in recording extracellular single-unit intracortical activity. IEEE Trans Biomed Eng, 1988. 35(9): p. 719-32.
3. Kipke, D.R., et al., Silicon-substrate intracortical microelectrode arrays for long-term recording of neuronal spike activity in cerebral cortex. IEEE Trans Rehab. Engin, 2003. In press.
4. Olsson, R.H., M.N. Gulari, and K.D. Wise. A fully-integrated bandpass amplifier for extracellular neural recording, in 1 st international IEEE EMBS Conference on Neural Engineering. 2003. Capri, Italy: IEEE.
5. Stark, B. and K. Najafi. An ultra-thin hermetic package utilizing electroplated gold, in Proc. 11th International Conference on Solid-State Sensors and Actuators (Transducers), 2001. Munich, Germany.
6. Hetke, J.F., et al. 3-D silicon probe array with hybrid polymer interconnect for chronic cortical recording, in 1st International IEEE EMBS Conf. on Neural Engin. 2003. Capri, Italy: IEEE.
7. Meyer, J.U., et al., High density interconnects and flexible hybrid assemblies for active biomedical implants. IEEE Trans Adv Packaging, 2001. 24(3): p. 366-375.
8. Nordhausen, C.T., E.M. Maynard, and R.A. Normann, Single unit recording capabilities of a 100 microelectrode array. Brain Research, 1996. 726(1-2): p. 129-40.
9. Bai, Q., K.D. Wise, and D.J. Anderson, A high-yield microassembly structure for three-dimensional microelectrode arrays. IEEE Trans Biomed Eng, 2000. 47(3): p. 281-9.