Electronic Package Failure Analysis Using TDR

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2000, Pages 277-283

  Smolyansky, Dima A ^a  

^a TDA Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC IMAGING; ALGORITHMS; ELECTRIC IMPEDANCE; FAILURE ANALYSIS; REFLECTOMETERS; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR DEVICE TESTING; THERMAL EFFECTS; TIME DOMAIN ANALYSIS; WAVEFORM ANALYSIS; X RAY ANALYSIS;

DECONVOLUTION ALGORITHMS; TIME DOMAIN REFLECTOMETRY (TDR);

ELECTRONICS PACKAGING;

EID: 1542270802     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. C. Odegard and C. Lambert, "Comparative TDR Analysis as a Packaging FA Tool," - ISTFA Proceedings 1999
2. P. Viswanadham, P. Singh, "Failure Modes and Mechanisms in electronic packages," - Chapman and Hall, 1998
3. M.D. Tilden, "Measuring Controlled-Impedance Boards with TDR," - Printed Circuit Fabrication, February 1992
4. Time Domain Reflectometry Theory, - Hewlett Packard Application Note 1304-2, May 1988
5. L.A. Hayden, V.K. Tripathi, "Characterization and modeling of multiple line interconnections from TDR measurements," - IEEE Transactions on Microwave Theory and Techniques, Vol. 42, September 1994, pp.1737-1743
6. D.A. Smolyansky, S.D. Corey, "PCB Interconnect Characterization from TDR Measurements" - TDA Systems Application Note PCBD-0699-02, published in Printed Circuit Design Magazine, May 1999
7. D.A. Rudy, J.P. Mendelsohn, P.J. Muniz, "Measurement of RF Dielectric Properties with Series Resonant Microstrip Elements," - Microwave Journal, March 1998, pp. 22-39
8. D. I. Amey, S.J. Horowitz, "Tests Characterize High-Frequency Material Properties," - Microwaves and RF, August 1997