Tests characterize high-frequency material properties

Microwaves and RF

Volumn 36, Issue 8, 1997, Pages 68-80

  Amey, Daniel I ^a   Horowitz, Samuel J ^a  

^a DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0002906782     PISSN: 07452993     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (11)

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2. D. Amey and S.J. Horowitz, "High-Frequency Characterization Of Advanced Ceramic Materials," Proceedings of the IEPS Annual Conference, 1996, pp. 673-582.
3. D. Amey and S.J. Horowitz, "Microwave Material Characterization," Proceedings of the ISHM International Symposium on Microelectronics, 1996, pp. 494-499.
4. J.P. Cazenave and T.R. Suess, "Fodel® Photo-Imageable Materials: A Thick-Film Solution For High-Density Multichip Modules," Proceedings of the International Symposium on Microelectronics (ISHM), 1993, pp 483-488.
5. S.J. Horowitz and C.R.S. Needes, "Smart Materials For Hybrid Circuits And Multichip Modules," Proceedings of the Japan IEMT Symposium," 1995.
6. R.R. Tummala and E.J. Rymaszowski, Microelectronic Packaging Handbook, Van Nostrand, 1989.
7. D. Partlow et al., "Effect Of Entrapped Carbon On The Microwave Dielectric Loss Of Silica-Based Ceramic Packaging Material," ISHM Journal of Microcircuits and Electronic Packaging, Vol. 19, No. 2, 1996, pp. 155-161.
8. H. Kanda et al., "Buried Resistors And Capacitors For Multilayer Hybrids," Proceedings of the ISHM International Symposium on Microelectronics, 1995, pp. 47-52.
9. S. Ladd et al., "Comparison Of A SuperSPARC™ Multichip Module: Diffusion Patterning™ And Fodel® MCM-C vs. MCM-D," Proceedings of the ISHM International Symposium on Microelectronics, 1995, pp. 307-312.
10. S. Ladd et al., "Design Tradeoffs Of MCM-C vs. Ball Grid Array On Printed Wiring Board," Proceedings of the Denver Multichip Module Conference, April 1996.
11. S.K. Ladd et al., "Workstation MCM Technology Comparison With Five Designs," International Conference on Multichip Modules, Denver, CO, April 2-4, 1997.