Evaluation of Alternative Preparation Methods for Failure Analysis at Modern Chip- and Package Technologies

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2001, Pages 83-86

  Dubotzky A ^a   Kruger B ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EXCIMER LASERS; FAILURE ANALYSIS; INFRARED IMAGING; INTEGRATED CIRCUITS; LASER ABLATION; METALLIZING; SURFACE STRUCTURE; X RAY ANALYSIS;

BACKSIDE ANALYSIS; FOCUSED ION BEAMS (FIB); SAND BLASTING METHODS;

CHIP SCALE PACKAGES;

EID: 1542270720     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. th Int. Symposium for Testing and Failure Analysis 2000, p. 553-558 (2000)
2. Y.S. Liu, H.S. Cole and R. Guida, "Laser ablation of polymers for high-density interconnect, Microelectronic Engineering, 20, p. 15-29 (1993)
3. M. Bothen and L. Kiesewetter, "Sandstrahlen in der Mikrosystemtechnik" Feinwerktechnik und Mikrotechnik, FuM, Carl Hanser Verlag, München, p. 74-77 (2001)
4. th Int. Symposium for Testing and Failure Analysis 2000, p. 177-185 (2000)