Failure Analysis from the Back Side of a Die

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2000, Pages 177-185

  Liebert, Silke ^a  

^a NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ANTIREFLECTION COATINGS; ATOMIC FORCE MICROSCOPY; CAMERAS; CHARGE COUPLED DEVICES; FAILURE ANALYSIS; FLIP CHIP DEVICES; MICROSCOPES; OPTICAL INTERCONNECTS; OPTICAL MICROSCOPY; PHOTOEMISSIVE DEVICES; SCANNING ELECTRON MICROSCOPY;

BACKSIDE FLOWS; PASSIVE VOLTAGE CONTRASTS; PHOTOEMISSION MICROSCOPE (PEM);

DIES;

EID: 1542360629     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. R.A.Soref, B.R. Bennett, IEEE J. Quant. Electron., 23, 123, (1987)
2. S. Seidel, V.R. Rao, A.N. Zaplatin, F.J. Low, ISTFA Proc., p. 471-476, (1999)
3. J. Colvin, ISTFA Proc., p. 365-375, (1999)
4. D.L.Barton, K.Bernhard-Höfer, E.I. Cole Jr., Microelectronics Reliability, 39, 721-30 (1999)
5. th edition, 213-229, Materials Park (1999)
6. C. Lue, H.G. Hughes, United States Patent, No. 5,207,866, (1993)
7. K. Krieg, R. Qi, D. Thomson, G. Bridges, ISTFA Proc., p.39-45, (1999)