Failure Analysis of Tungsten Contact Failure in a 0.13 μm CMOS Process

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2002, Pages 169-171

  Bagchi, Sandeep ^a   Subramanian, Sam ^a   Ross, Ryan ^a   Beck, James ^a   Chrastecky, Tony ^a   Soorholtz, Vince ^a   Widener, Ed ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MASSIVE ARRAY FAILURES;

AMORPHOUS SILICON; DATA STRUCTURES; ELECTRIC CONTACTS; FAILURE ANALYSIS; STATIC RANDOM ACCESS STORAGE; TRANSMISSION ELECTRON MICROSCOPY; TUNGSTEN;

CMOS INTEGRATED CIRCUITS;

EID: 1542270308     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. L. Giannuzzi, J. L. Drown, S. R. Brown, R. B. Irwin, and F. A. Stevie, Mat. Res. Soc. Symp. Proc.,Vol. 480, (1997), 19.
2. th International Symposium on Testing and Failure Analysis, (2000), 415.
3. S.-C. Song, S. Filipiak, A. Perera, M. Turner, F. Huang, S. G. H. Andersen, L. Kang, B. Min, D. Menke, S. Tukunang, and S. Venkatesan, 2002 Symposium on VLSI Technology- Digest of Technical Papers, (2002), 72.