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Volumn 36, Issue 6, 2005, Pages 806-826

Numerical analysis of cure temperature and internal stresses in thin and thick RTM parts

Author keywords

B. Cure behaviour; B. Residual internal stress; B. Thermomechanical; C. Numerical analysis; E. Resin transfer moulding (RTM)

Indexed keywords

COMPOSITE MATERIALS; CURING; DEFORMATION; FINITE DIFFERENCE METHOD; MATHEMATICAL MODELS; POLYMERIZATION; PYROLYSIS; RESIDUAL STRESSES; RHEOLOGY; THERMAL CONDUCTIVITY; THERMAL GRADIENTS; THERMOMECHANICAL TREATMENT; THERMOSETS;

EID: 15344342597     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesa.2004.10.021     Document Type: Article
Times cited : (161)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.