Agglomeration characteristic of particles in alumina slurry by addition of chemicals and milling process for Cu CMP

Materials Science and Engineering: B

Volumn 118, Issue 1-3, 2005, Pages 306-309

  Choi, Min Ho ^a   Kim, Nam Hoon ^a   Lim, Jong Heun ^a   Kim, Sang Yong ^b   Chang, Eui Goo ^a  

^a Chung Ang University   (South Korea)

^b DongbuAnam Semiconductor Co   (South Korea)

Author keywords

Agglomeration; Chemical mechanical polishing; Milling process; Particle size

Indexed keywords

AGGLOMERATION; CHARACTERIZATION; CHEMICAL MECHANICAL POLISHING; COMMINUTION; COPPER; PARTICLE SIZE ANALYSIS; SLURRIES;

ALUMINA SLURRY; FILM FORMING AGENT; GLOBAL PLANARIZATION; MILLING PROCESS;

ALUMINA;

EID: 15344341762     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2004.12.059     Document Type: Conference Paper

References (12)

1. I. Heyvaert, M. Van Hove, A. Witvrouw, K. Maex, A. Saerens, P. Roussel, and H. Bender Microelectron. Eng. 50 2000 291
2. S.-Y. Kim, and Y.-J. Seo Microelectron. Eng. 3/4 2002 357
3. S.Y. Kim, N.H. Kim, I.P. Kim, E.G. Chang, Y.J. Seo, and H.S. Chung Trans. EEM 4 2003 28
4. S.Y. Jeong, Y.J. Seo, and S.Y. Kim Trans. EEM 3 2002 5
5. F.B. Kaufman, D.B. Thompson, R.E. Broadie, M.A. Jaso, W.L. Guthrie, D.J. Pearson, and M.B. Small J. Electrochem. Soc. 138 1991 3460
6. S.M. Lee, U. Mahajan, Z. Chen, and R.K. Singh Proc. ECS 37 1999 187
7. Q. Luo, D.R. Campbell, and S.V. Babu Am. Chem. Soc., Langmuir 12 1996 3563
8. T. Laursen, and M. Grief J. Electron. Mater. 31 2002 1059
9. J.M. Steigerwald, R. Zirpoli, S.P. Murarka, D. Price, and R.J. Gutmann J. Electochem. Soc. 141 1994 2842
10. S.Y. Kim, J.H. Lim, C.H. Yu, N.H. Kim, and E.G. Chang Trans. EEM 4 2003 1
11. T. Du, Y. Luo, and V. Desai Microelectron. Eng. 71 2004 90
12. D.C. Kim, J.Y. Ryu, and T.K. Lim J. Korean Phys. Soc. 29 1996 460