Novel chemical approach to achieve advanced soft lithography by developing new stiffer, photocurable PDMS stamp materials

Materials Research Society Symposium Proceedings

Volumn 820, Issue , 2004, Pages 147-154

  Choi, Kyung M ^a   Rogers, John A ^b  

^a LUCENT TECHNOLOGIES   (United States)

^b University of Illinois at Urbana Champaign   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; ELASTOMERS; MOLDING; PHOTOLITHOGRAPHY; POLYMERIZATION; SILICON COMPOUNDS; STAMPING; STIFFNESS; ULTRAVIOLET RADIATION;

MICROFABRICATION; PHOTOCURING; SOFT LITHOGRAPHY; THERMAL DEFORMATION;

LITHOGRAPHY;

EID: 14944378917     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-820-o6.2     Document Type: Conference Paper

References (8)

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4. C. J. Love, J. R. Anderson, and G. M. Whitesides, MRS Bulletin 26(7), 523 (2001).
5. H. Schmid and B. Michel, "Siloxane Polymers for High-Resolution, High-Accuracy Soft Lithography", Macromolecules 33, 3042 (2000).
6. T. W. Odom, J. C. Love, D. B. Wolfe, K. E. Paul, and G. M. Whitesides, "Improved Pattern Transfer in Soft Lithography using Composite Stamps', Langmuir 18, 5314 (2002).
7. D. H. Gracias, V. Kavthekar, L. J. Christopher, K. E. Paul, and G. M. Whitesides, "Fabrication of Micrometer-Scale, Patterned Polyhedra by Self-Assembly", Adv. Mater. 14(3), 235 (2002).
8. K. M. Choi and J. A. Rogers, "A Photocurable Poly(dimethylsiloxane) Chemistry Designed for Soft Lithograpic Molding and Printing in the Nanometer Regime", J. Am. Chem. Soc., 125, 4060 (2003).