Enhanced UV imprint ability with a tri-layer stamp configuration

Microelectronic Engineering

Volumn 78-79, Issue 1-4, 2005, Pages 689-694

  Roy, E ^a   Kanamori, Y ^a   Belotti, M ^a   Chen, Y ^a,b  

^a CNRS   (France)

^b ECOLE NORMALE SUPÉRIEURE   (France)

Author keywords

Nanofabrication; Nanoimprint; Pattern transfer; Soft lithography

Indexed keywords

MICROELECTRONICS; NANOTECHNOLOGY; RELIABILITY; THERMOPLASTICS; THROUGHPUT; TRANSPARENCY; ULTRAVIOLET RADIATION;

NANOIMPRINT; PATTERN TRANSFER; SOFT LITHOGRAPHY; SUB-RESOLUTION;

LITHOGRAPHY;

EID: 14944339226     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.12.086     Document Type: Conference Paper

References (4)

1. P.R. Krauss, and S.Y. Chou Appl. Phys. Lett. 71 1997 3174
2. T. Bailey, B.J. Choi, M. Colburn, M. Meissi, S. Shaya, J.G. Ekerdt, S.V. Sreenivasan, and C.G. Willson J. Vac. Sci. Technol. B 18 6 2000 3572
3. U. Plachetka, M. Bender, A. Fuchs, B. Vratzov, T. Glinsner, F. Lindner, and H. Kurz Microelectron. Eng. 73-74 2003 167
4. M. Colburn, S. Johnson, M. Stewart, S. Damle, B. Jin, T. Bailey, M. Wedlake, T. Michaelson, S.V. Sreenivasan, J. Ekerdt, and C.G. Willson Proc. SPIE 3676 1999 379