-
1
-
-
0033452538
-
Applicability of traditional turbulent single-phase forced convection correlations to non-circular microchannels
-
Adams, T. M., Dowling, M. F., Abdel-Khalik, S. I., and Jeter, S. M., Applicability of Traditional Turbulent Single-Phase Forced Convection Correlations to Non-Circular Microchannels, International Journal of Heat and Mass Transfer, vol. 42, no. 23, pp. 4411-4415, 1999.
-
(1999)
International Journal of Heat and Mass Transfer
, vol.42
, Issue.23
, pp. 4411-4415
-
-
Adams, T.M.1
Dowling, M.F.2
Abdel-Khalik, S.I.3
Jeter, S.M.4
-
2
-
-
0000079019
-
Alignment of mask patterns to crystal orientation
-
Ensell, G., Alignment of Mask Patterns to Crystal Orientation, Sensors and Actuators A, vol. 53, pp. 345-348, 1996.
-
(1996)
Sensors and Actuators A
, vol.53
, pp. 345-348
-
-
Ensell, G.1
-
3
-
-
0031360416
-
High power multichip modules employing the planar embedding technique and microchannel water heat sinks
-
Hahn, R., Kamp, A., Ginolas, A., Schmidt, M., Wolf, J., Glaw, V., Toepper, M., Ehrmann, O., and Reichl, H., High Power Multichip Modules Employing the Planar Embedding Technique and Microchannel Water Heat Sinks, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 20, no. 4, pp. 432-441, 1997.
-
(1997)
IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A
, vol.20
, Issue.4
, pp. 432-441
-
-
Hahn, R.1
Kamp, A.2
Ginolas, A.3
Schmidt, M.4
Wolf, J.5
Glaw, V.6
Toepper, M.7
Ehrmann, O.8
Reichl, H.9
-
4
-
-
44949164847
-
International technology roadmap for semiconductors, 2003 ed
-
International Technology Roadmap for Semiconductors, 2003 ed., Assembly and Packaging, Available at, http://public.itrs.net/Files/2003ITRS/Home2003.htm
-
Assembly and Packaging
-
-
-
5
-
-
0029191566
-
Fabrication of monolithic microchannels for IC chip cooling
-
Joo, Y., Dieu, K., and Kim, C.-J., Fabrication of Monolithic Microchannels for IC Chip Cooling, MEMS '95, Proc. IEEE, p. 362, 1995.
-
(1995)
MEMS '95, Proc. IEEE
, pp. 362
-
-
Joo, Y.1
Dieu, K.2
Kim, C.-J.3
-
6
-
-
10444249568
-
Evaluation of single phase flow in microchannels for high flux chip cooling-thermohydraulic performance enhancement and fabrication technology
-
Kandlikar, S. G., and Grande, W. J., Evaluation of Single Phase Flow in Microchannels for High Flux Chip Cooling-Thermohydraulic Performance Enhancement and Fabrication Technology, Heat Transfer Engineering, vol. 25, no. 8, 1-13, 2004.
-
(2004)
Heat Transfer Engineering
, vol.25
, Issue.8
, pp. 1-13
-
-
Kandlikar, S.G.1
Grande, W.J.2
-
7
-
-
0023330725
-
Cooling characteristics of diamond-shaped interrupted cooling fin for high power LSI devices
-
Kishimoto, T., and Sasaki, S., Cooling Characteristics of Diamond-Shaped Interrupted Cooling Fin for High Power LSI Devices, Electronics Letters, vol. 23, pp. 456-457, 1987.
-
(1987)
Electronics Letters
, vol.23
, pp. 456-457
-
-
Kishimoto, T.1
Sasaki, S.2
-
8
-
-
0344440943
-
Effect of tip clearance on the cooling performance of a microchannel heat sink
-
Min, J. Y., Jang, S. P., and Kim, S. J., Effect of Tip Clearance on the Cooling Performance of a Microchannel Heat Sink, International Journal of Heat and Mass Transfer, vol. 47, no. 5, pp. 1099-1103, 2004.
-
(2004)
International Journal of Heat and Mass Transfer
, vol.47
, Issue.5
, pp. 1099-1103
-
-
Min, J.Y.1
Jang, S.P.2
Kim, S.J.3
-
9
-
-
0034484409
-
Analytic modeling, optimization, and realization of cooling devices in silicon technology
-
Perret, C., Boussey, J., Schaeffer, C., and Coyaud, M., Analytic Modeling, Optimization, and Realization of Cooling Devices in Silicon Technology, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies, vol. 23, no. 4, pp. 665-672, 2000.
-
(2000)
IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies
, vol.23
, Issue.4
, pp. 665-672
-
-
Perret, C.1
Boussey, J.2
Schaeffer, C.3
Coyaud, M.4
-
10
-
-
0019563707
-
High performance heat sinking for VLSI
-
Tuckerman, D. B., and Pease, R. F. W., High Performance Heat Sinking for VLSI, IEEE Electronic Device Letters, vol. EDL 2, pp. 126-129, 1981.
-
(1981)
IEEE Electronic Device Letters
, vol.EDL 2
, pp. 126-129
-
-
Tuckerman, D.B.1
Pease, R.F.W.2
-
11
-
-
14644429145
-
-
Bas Tummers, Johannes van Eindhovenstraat 8, 5611 TL Eindhoven, The Netherlands
-
Tummers, B., Huyser, K., and Van der Laan, J., DataThief for PC and Macintosh, http://www.nikhef.nl/~keeshu/datathief/man/manual.html, Bas Tummers, Johannes van Eindhovenstraat 8, 5611 TL Eindhoven, The Netherlands.
-
DataThief for PC and Macintosh
-
-
Tummers, B.1
Huyser, K.2
Van Der Laan, J.3
-
12
-
-
1542592250
-
Effect of condenser location and imposed circulation on the performance of a compact two-phase thermosyphon for high power LSI devices
-
Banff, Alberta, Canada, October 15-20
-
Yuan, L., Joshi, Y. K., and Nakayama, W., Effect of Condenser Location and Imposed Circulation on the Performance of a Compact Two-Phase Thermosyphon for High Power LSI Devices, Engineering Foundation Conference on Heat Transfer and Transport Phenomena for Microsystems, Banff, Alberta, Canada, October 15-20, pp. 304-311, 2000; Electronics Letters, vol. 23, pp. 456-457, 1987.
-
(2000)
Engineering Foundation Conference on Heat Transfer and Transport Phenomena for Microsystems
, pp. 304-311
-
-
Yuan, L.1
Joshi, Y.K.2
Nakayama, W.3
-
13
-
-
0023330725
-
-
Yuan, L., Joshi, Y. K., and Nakayama, W., Effect of Condenser Location and Imposed Circulation on the Performance of a Compact Two-Phase Thermosyphon for High Power LSI Devices, Engineering Foundation Conference on Heat Transfer and Transport Phenomena for Microsystems, Banff, Alberta, Canada, October 15-20, pp. 304-311, 2000; Electronics Letters, vol. 23, pp. 456-457, 1987.
-
(1987)
Electronics Letters
, vol.23
, pp. 456-457
-
-
|