Mechanical behavior of Σ tilt grain boundaries in nanoscale Cu and Al: A quasicontinuum study

Acta Materialia

Volumn 53, Issue 7, 2005, Pages 1931-1944

  Sansoz, F ^a   Molinari, J F ^b  

^a University of Vermont   (United States)

^b Johns Hopkins University   (United States)

Author keywords

Grain boundary cohesion; Grain boundary structure; Nanocrystalline materials; Quasicontinuum method; Simulation

Indexed keywords

COMPUTER SIMULATION; DEFORMATION; NANOSTRUCTURED MATERIALS; NUCLEATION; SHEAR STRESS; STRAIN; STRENGTH OF MATERIALS; STRESS RELAXATION;

BICRYSTALS; GRAIN BOUNDARY COHESION; GRAIN BOUNDARY STRUCTURE; QUASICONTINUUM METHOD;

GRAIN BOUNDARIES;

EID: 14644414229     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2005.01.007     Document Type: Article

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