Bond-and-transfer scanning probe array for high-density data storage

IEEE Transactions on Magnetics

Volumn 41, Issue 2, 2005, Pages 989-991

  Hsieh, Gen Wen ^a   Tsai, Ching Hsiang ^a   Lin, We Chih ^a   Liang, Chao Chiun ^a   Lee, Yu Wen ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Data storage; Electrostatic force bonding; Scanning probe array

Indexed keywords

CATHODES; DIELECTRIC MATERIALS; ELECTRIC FIELDS; IONIZATION; IONS; MIXTURES; SILICON NITRIDE; SILICON WAFERS; SURFACE TREATMENT; THIN FILMS;

ELECTROSTATIC FORCE BONDING; GLASS SUBSTRATE; MICROFABRICATION; SCANNING PROBE ARRAY;

DATA STORAGE EQUIPMENT;

EID: 14544274992     PISSN: 00189464     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMAG.2004.842070     Document Type: Article

References (7)

1. M. Despont, U. Drechsler, R. Yu, H. B. Pogge, and P. Vettiger, "Waferscale microdevice transfer/interconnect: Form a new integration method to its application in an AFM-based data-storage system," in Proc. Transducers '03, Boston, MA, Jun. 2003, pp. 1907-1910.
2. A. Cozma and B. Puers, "Characterization of the electrostatic bonding of silicon and pyrex glass," J. Micromech. Microeng, vol. 5, pp. 98-102, 1995.
3. J. Wei, H. Xie, M. L. Nai, C. K. Wong, and L. C. Lee, "Low temperature wafer anodic bonding," J. Micromech. Microeng., vol. 13, pp. 217-222, 2003.
4. M. H. Lee, H. Y. Lee, Y. N. Liaw, I. K. Lao, and I. M. Hsing, "Detailed characterization of anodic bonding process between glass and thin-film coated silicon substrates," Sens. Actuators A, Phys., vol. 86, pp. 103-107, 2000.
5. M. Luteyche, C. Andreoli, G. Binnig, J. Brugger, U. Drechsler, W. Haberle, H. Rohrer, H. Rothuizen, P. Vettiger, G. Yaralioglu, and C. Quate, "5 × 5 2D AFM cantilever arrays a first step toward a terabit storage device," Sens. Actuators A, Phys., vol. 73, pp. 89-94, 1999.
6. K. Wilder and C. Quate, J. Vac. Sci. Technol B, Microelectron. Process. Phenom., vol. 17, pp. 3256-3261, 1999.
7. P. Vettiger, G. Gross, M. Despont, U. Drechsler, U. Dutig, B. Gotsmann, W. Haberle, M. A. Lantz, H. E. Rothuizen, R. Stutz, and G. K. Binnig, "The "Millipede"-Nanotechnology entering data storage," IEEE Trans. Nanotechnol., vol. 1, pp. 39-55, Mar. 2002.