The effect of CuSn intermetallics on the interstrand contact resistance in superconducting cables for the large hadron collider

Journal of Applied Physics

Volumn 97, Issue 3, 2005, Pages

  Scheuerlein, C ^a   Gasser, Ph ^b   Jacob, P ^b   Leroy, D ^a   Oberli, L ^a   Taborelli, M ^a  

^a CERN   (Switzerland)

^b Eidgen Materialprufungs/Forsch A   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

FOCUSED ION BEAMS (FIB); INTERSTRAND CONTACT RESISTANCE; LARGE HADRON COLLIDER (LHC); LIQUID-SOLID REACTIONS;

COLLIDING BEAM ACCELERATORS; COPPER COMPOUNDS; ENERGY DISPERSIVE SPECTROSCOPY; INTERMETALLICS; ION BEAMS; MICROSTRUCTURE; PROTECTIVE COATINGS; SURFACE TOPOGRAPHY; TRANSMISSION ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

SUPERCONDUCTING CABLES;

EID: 13644284570     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1849429     Document Type: Article

References (32)

1. The LHC Study Group, CERN/AC/95-05, 1995.
2. J. D. Adam et al., IEEE Trans. Appl. Supercond. 12, 1056 (2002).
3. J.-M. Depend, D. Leroy, L. R. Oberli, and D. Richter, IEEE Trans. Appl. Supercond. 7, 793 (1997).
4. D. Richter, J. D. Adam, D. Leroy, and L. R. Oberli, IEEE Trans. Appl. Supercond. 9, 735 (1999).
5. D. Richter, J. D. Adam, J.-M. Depond, D. Leroy, and L. R. Oberli, IEEE Trans. Appl. Supercond. 7, 786 (1997).
6. A. K. Ghosh, SSC Technical Note No. 103, SSCL-N-808 1992.
7. A. Nijhuis, H. H. J. ten Kate, V. Pantsyrny, A. K. Shikov, and M. Santini, IEEE Trans. Appl. Supercond. 10, 1051 (2000).
8. M. D. Sumption, E. W. Collings, R. M. Scanlan, A. Nijhuis, H. H. J. ten Kate, S. W. Kim, M. Wake, and T. Shintomi, Cryogenics 39, 1 (1999).
9. B. R. Allenby et al., Surface Mount Int. 2, 1251 (1992).
10. P. Lauro, S. K. Kang, W. K. Choi, and D. Y. Shi, J. Electron. Mater. 32, 1432 (2003).
11. M. M. Schwartz, Fundamentals of Soldering, ASM Handbook Vol. 6 (American Society for Metals, Metals Park, OH, 1993).
12. H. J. Reynolds and J. W. Morris, J. Electron. Mater. 24, 1429 (1995).
13. W. Huang, J. M. Loman, B. Sener, Microelectron. Reliab. 42, (2002), 1229
14. Alloy Phase Diagrams, ASM Handbook Vol. 3 (American Society for Metals, Metals Park, OH, 1992).
15. P. T. Vianco, K. L. Erickson, and P. L. Hopkins, J. Electron. Mater. 23, 721 (1994).
16. F. Ochoa, J. J. Williams, and N. Chawla, J. Electron. Mater. 32, 1414 (2003).
17. I. E. Anderson, B. A. Cook, J. Harringa, and R. L. Terpstra, J. Electron. Mater 31, 1166 (2002).
18. K. N. Tu and R. D. Thompson, Acta Metall. 30, 947 (1982).
19. N. Presser, M. R. Hilton, Thin Solid Films, 308-309, 369 (1997)
20. C. Scheuerlein, G. Arnau Izquierdo, N. Charras, L. R. Oberli, and M. Taborelli, J. Electrochem. Soc. 151, E206 (2004).
21. C. Scheuerlein, M. Carosone, S. Ilie, D. Letant, and C. Petitjean, CERN, AT-MAS Technical note 2004-01 2004.
22. Ph. Gasser, U. Klotz, F. A. Khalid, and O. Beffort, Microsc. Microanal. 10, 1 (2004).
23. S. Bader, W. Gust, and H. Hieber, Acta Metall. Mater. 43, 329 (1995).
24. L. Kogut and K. Komvopoulos, J. Appl. Phys. 94, 3153 (2003).
25. L. Kogut and K. Komvopoulos, J. Appl. Phys. 95, 576 (2004).
26. H. Oikawa and A. Hosoi, Scr. Metall. 9, 823 (1975).
27. D. M. Tench, in The Mechanics of Solder Alloy Wetting & Spreading, edited by F. G. Yost, F. M. Hosking, and D. R. Frear (Van Nostrand Reinhold, New York, 1993).
28. X. Deng, M. Koopman, N. Chawla, and K. K. Chawla, Mater. Sci. Eng., A 364, 240 (2004).
29. Handbook of Chemistry and Physics, 76th ed., edited by D. R. Lide (CRC, Boca Raton, FL, 1995).
30. J. P. Lucas, A. W. Gibson, and K. N. Subramanian, Mater. Res. Soc. Symp. Proc. 522, 3 (1998).
31. R. R. Chromik, R. P. Vinci, S. L. Allen, and M. R. Nous, J. Mater. Res. 18, 2251 (2003).
32. H. P. R. Frederikse, R. J. Fields, and A. Feldman, J. Appl. Phys. 72, 2879 (1992).