Microstructure evaluation and strengthening mechanism of Ni-P-W alloy coatings

Surface and Coatings Technology

Volumn 177-178, Issue , 2004, Pages 312-316

  Wu, F B ^a   Tien, S K ^a   Chen, W Y ^a   Duh, J G ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Electroless plating; Microhardness; Ni P based ternary coating; RF magnetron sputtering; Strengthening

Indexed keywords

CRYSTAL STRUCTURE; DEPOSITION; ELECTROLESS PLATING; MAGNETRON SPUTTERING; MICROHARDNESS; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; NICKEL ALLOYS; PRECIPITATION (CHEMICAL); STEEL;

COMPOSITIONAL DISTRIBUTIONS;

COATINGS;

MICROSTRUCTURE;

EID: 1342331941     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2003.09.010     Document Type: Article

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