Thermal stability of sputtered Ni-P and Ni-P-Cr coatings during cycling test and annealing treatment

Surface and Coatings Technology

Volumn 177-178, Issue , 2004, Pages 222-226

  Chen, Wei Yu ^a   Duh, Jenq Gong ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Microhardness; Ni P Cr deposit; RF sputtering; Sputtered Ni P; Thermal cycle

Indexed keywords

ANNEALING; BINARY ALLOYS; MAGNETRON SPUTTERING; MICROHARDNESS; NICKEL ALLOYS; PRECIPITATION (CHEMICAL); TERNARY SYSTEMS; THERMODYNAMIC STABILITY; X RAY DIFFRACTION ANALYSIS;

AMORPHOUS STRUCTURES; ELECTRON PROBE MICROANALYSIS;

COATINGS;

COATING;

EID: 1342310608     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2003.09.036     Document Type: Article

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