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Microelectronic Engineering

Volumn 77, Issue 2, 2005, Pages 116-124

Micro-scale metallization of high aspect-ratio Cu and Au lines on flexible polyimide substrate by electroplating using SU-8 photoresist mask

(4) Cho, S H a Kim, S H a Lee, J G a Lee, N E a

a Sungkyunkwan University (South Korea)

Author keywords

Au electrode; Cu metallization; Electroplating; Flexible electronics; Gap filling; Polyimide

Indexed keywords

ASPECT RATIO; BIOCOMPATIBILITY; COPPER; ELECTRODES; ELECTROPLATING; GOLD; MASKS; PHOTORESISTS; POLYIMIDES; SUBSTRATES;

AU ELECTRODES; CU METALLIZATION; FLEXIBLE ELECTRONICS; GAP FILLING;

METALLIZING;

EID: 12444343019 PISSN: 01679317 EISSN: None Source Type: Journal
DOI: 10.1016/j.mee.2004.09.007 Document Type: Article

Times cited : (38)

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