Characterization of time and temperature dependent mechanical behavior of underfill materials in electronic packaging application

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 473-483

  Kuo, Chia Tai ^a   Yip, Ming Chuen ^a   Chiang, Kuo Ning ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Creep; Strain rate; Thermo mechanical testing; Underfill films

Indexed keywords

ADHESION; CREEP; ELASTIC MODULI; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MORPHOLOGY; OPTIMIZATION; PLASTIC DEFORMATION; SOLDERED JOINTS; STRAIN RATE; SUBSTRATES; BOND STRENGTH (MATERIALS); CREEP TESTING; ELECTRONICS PACKAGING; FILLED POLYMERS; FRACTURE; INORGANIC COATINGS; MECHANICAL ENGINEERING; MOISTURE; PACKAGING MATERIALS; SPECIMEN PREPARATION; SURFACES; TENSILE STRENGTH; UNLOADING;

THERMOMECHANICAL TESTING; UNDERFILL FILMS; ADHESION STRENGTHS; CREEP CURVES; DEFORMATION RATES; ELECTRONIC COMPONENT; ELECTRONIC PACKAGING; FR4 SUBSTRATES; FRACTURE STRAIN; FRACTURE SURFACES; LOAD DEFORMATION; MATERIAL MICROSTRUCTURES; MECHANICAL BEHAVIOR; SOLDER MASK; STRESS LEVELS; STRESS-STRAIN BEHAVIORS; SURFACE ADHESION; TEMPERATURE DEPENDENT; TEST METHODOLOGY; TEST RESULTS; THERMAL ENVIRONMENT; THERMO-MECHANICAL TESTING; TIME-TEMPERATURE; UNDERFILL MATERIALS; UNDERFILLS; YOUNG'S MODULE; YOUNG'S MODULUS;

ELECTRONICS PACKAGING; STRAIN RATE;

EID: 1242287141     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35232     Document Type: Conference Paper

References (10)

1. Q. Tong, B. Ma, A. Xiao, and A. Savoca, "Fundamental Adhesion Issues for Advanced Flip Chip Packaging," IEEE Electronic Components and Technology Conference, pp.1373-1379, (2002).
2. Zhengfang Qian, Jian Yang, and Sheng Liu, "Visco-Elastic- Plastic Properties and Constitutive Modeling of Underfills," Electronic Components and Technology Conference, pp.969-974, (1998).
3. D. Suryanarayana, R. Hisao, T. P. Gall, and J. M. McCreary, "Enhancement of flip-chip fatigue life by encapsulation," IEEE Trans., Comp., Hybrids, Manufact. technol., vol. 14 pp. 218-223, (1991).
4. S. Rzepka, M. A. Korhonen, E. Meusel, and C. Y. Li, "The effect of underfill and underfill delamination on the thermal stress in flip-chip solder joints," ASME Trans. J. Electron. Packag., vol. 120, pp. 342-348, 1998.
5. H. Doi, K. Kawano, A. Yasukawa, and T. Sato, "Reliability of underfill-encapsulated flip-chips with heat spreaders," ASME Trans. J. Electron. Packag., vol. 120, pp. 322-327, 1998.
6. S. H. Shi, Q. Yao, J. Qu, and C.P. Wong, "Study on the Correlation of Flip-Chip Reliability with Mechanical Property of No-Flow Underfill Material," International Symposium on Advanced Packaging Material, pp.271-277, (2000).
7. A. J Kinloch, "Adhesion and Adhesives," Chapman and Hall, New York, 1987.
8. Robert Darneaux, Kingshuk Banerji, "Constitutive relations for Tin-Based Solder Joints," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 15, No. 6 (1992), pp. 1013-1024.
9. D. C. D. Lam, F. Yang, and P. Tong, "Chemical Kinetic Model of Interfacial Degradation of adhesive Joints," IEEE Transaction on Components and Packaging Technology, vol. 22, 1999, pp.215-220.
10. th Electronic Components and Technology Conference, 2000, pp. 576-580.