Externally guided underfill encapsulation and subsequent filler particle migration during electronics packaging

Journal of Micromechanics and Microengineering

Volumn 14, Issue 2, 2004, Pages 212-219

  Tso, C P ^a   Sundaravadivelu, K ^a   Zhang, L B ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT ANGLES; FREE SURFACES; SHEAR RATES;

DATA REDUCTION; DIFFUSION; ELECTRIC FIELD EFFECTS; FINITE VOLUME METHOD; FLOW OF FLUIDS; PERMITTIVITY; POLARIZATION; TENSORS; VECTORS; VOLUMETRIC ANALYSIS;

ELECTRONICS PACKAGING;

EID: 1242265197     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/14/2/007     Document Type: Article

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