Numerical simulation of the flip-chip underfilling process

Proceedings of the Electronic Technology Conference, EPTC

Volumn , Issue , 1997, Pages 263-269

  Tay, A A O ^a   Huang, Z M ^a   Wu, J H ^a   Cui, C Q ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; NAVIER STOKES EQUATIONS; SURFACE TENSION; VISCOSITY;

UNDERFILLING PROCESS;

MICROELECTRONIC PROCESSING;

EID: 0031316709     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)