Impact of low temperatures on solder joint failures

Journal of Electronic Packaging

Volumn 124, Issue 2, 2002, Pages 135-137

  Mirman, Boris ^a  

^a SUFFOLK UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0039486035     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1465431     Document Type: Article

References (20)

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3. Mirman, B., 1996, "Choice of Models and Failure Indicators for Thermally Loaded Solder Joints," NEPCON East, pp. 295-311.
4. Mirman, B., 2000, "Lead-On-Chip versus Chip-On-Lead Packages and Solder Failure Criteria," ASME J. Electron. Packag. 122, pp. 279-280.
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10. Knecht, S., 1990, "Integrated Matrix Creep: Application to Lifetime Prediction of Eutectic Tin-Lead Solder Joints," Mater. Res. Soc. Symp. Proc.
11. Knecht, S., and Fox, L., 1991, "Integrated Matrix Creep: Application to Accelerated Testing and Lifetime Prediction," Solder Joint Reliability, J. H. Lau, ed., Van Nostrand, N.Y.
12. Wild, R., 1973, "Some Fatigue Properties of Solders and Solder Joints," IBM, No. 73Z000421.
13. Tien, J., Hendrix, B., and Attarwala, A., 1989, "The Interaction of Creep and Fatigue in Lead-Tin Solders," IEEE Trans. on CHMT, 12(4), pp. 480-491.
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15. Engelmaier, W., and Fuentes, B., 1995, "Alloy-42 - a Material To Be Avoided for Surface Mount Component Leads and Lead Frames," NEPCON West, pp. 1730-1742.
16. Subrahmanyan, R., Wilcox, J. R., and Li, C.-Y., 1989, "A Damage Integral Approach to Thermal Fatigue of Solder Joints," IEEE Trans. CHMT, 12(4), pp. 480-491.
17. Li, C.-Y., Subrahmanyan, R., Wilcox, R. J., and Stone, D., 1991, "A Damage Integral Methodology for Thermal and Mechanical Fatigue of Solder Joints," Solder Joint Reliability, J. H. Lau, ed., Van Nostrand, N. Y., pp. 361-383.
18. Mohr, O., 1900, "Welche Umstände bedingen die Elastizitätsgrenze und den Bruch eines Materials?," Zeitschrift des Vereines deutcher Ingenieure, 44, pp. 1524-1530.
19. Mirman, B., and Knecht, S., 1990, "Creep Strain in an Elongated Bond Layer," IEEE Trans. on CHMT, 13(4), pp. 914-928.
20. Zubelewicz, A., 1992, Private communication.