Synthesis and characterization of nano-composite lead-free solder

Journal of Metastable and Nanocrystalline Materials

Volumn 23, Issue , 2005, Pages 145-148

  Lin, D C ^a   Kuo, C Y ^a   Srivatsan, T S ^a   Petraroli, M ^b   Wang, G X ^a  

^a University of Akron   (United States)

^b TIMKEN COMPANY   (United States)

Author keywords

Composite; Hardness; Microstructure; Reinforcement; Solder; Solidification

Indexed keywords

COOLING; EUTECTICS; HARDNESS; INTERMETALLICS; MICROHARDNESS; MICROSTRUCTURE; SOLIDIFICATION; TRACE ELEMENTS;

LEAD-FREE SOLDERS; MICROGRAPHS; MONOLITHIC COUNTERPARTS; NANOPOWDERS;

SOLDERING ALLOYS;

EID: 12344311956     PISSN: 14226375     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

References (6)

1. "Composite Solders," IBM Technical Disclosure Bulletin,Vol. 29 (1986), p.1573.
2. Guo, F.; Choi, S.; Lucas, J.P.; Subramanian, K.N., Microstructural characterisation of reflowed and isothermally-aged Cu and Ag particulate reinforced Sn-3.5Ag composite solders, Soldering & Surface Mount Technology, Vol.13 (2001), p.7.
3. Guo, F., Lucas, J. P.; Subramanian, K. N., Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5Ag and Sn-4.0Ag-0.5Cu non-composite solder joints, Journal of Materials Science: Materials in Electronics, Vol.12 (2001), p.27.
4. Lee, J.G., Guo, F., Subramanian, K.N., Lucas, J.P, Intermetallic morphology around Ni particles in Sn-3.5Ag solder. Soldering and Surface Mount Technology, Vol.14 (2002), p. 11.
5. Lin, D., Wang, G.X., Srivatsan, T.S., Al-Hajri, Meslet; Petraroli, M. The influence of copper nanopowders on microstructure and hardness of lead-tin solder. Materials Letters, Vol.53 (2002), p.333
6. Okamoto, H. Hiroaki: Phase diagrams of dilute binary alloys, ASM International, Materials Park, Ohio, 2002.