Characterization of substrate materials for system-in-a-package applications

Journal of Electronic Packaging

Volumn 126, Issue 2, 2004, Pages 195-201

  Chen, Liu ^a   Andræ, Anders S G ^a   Zou, Gang ^a   Liu, Johan ^a  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COOLING; ELASTIC MODULI; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; LIQUID CRYSTAL POLYMERS; PERMITTIVITY; POLYTETRAFLUOROETHYLENES; RELIABILITY; STRESS CONCENTRATION; THERMAL EXPANSION;

COEFFICIENT OF THERMAL EXPANSION (CTE); ELECTRICAL PERFORMANCE; MANUFACTURING PROCESSES; WARPAGE;

ELECTRONICS PACKAGING;

EID: 12344308192     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1648057     Document Type: Article

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