Low cost options for next generation packaging

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 457-459

  Vardaman, E J ^a  

^a TECHSEARCH INTERNATIONAL   (United States)

Author keywords

Chip scale packaging; Circuits; Consumer products; Costs; Home appliances; Microcomputers; Mobile communication; Mobile handsets; Transistors; Wafer scale integration

Indexed keywords

CONSUMER PRODUCTS; COSTS; DOMESTIC APPLIANCES; ELECTRONICS PACKAGING; MICROCOMPUTERS; MOBILE TELECOMMUNICATION SYSTEMS; NETWORKS (CIRCUITS); PERSONAL COMPUTERS; SYSTEM-IN-PACKAGE; TELEPHONE SETS; TRANSISTORS; WSI CIRCUITS;

CHIP-SCALE PACKAGING; LOW-COST PACKAGING; MOBILE COMMUNICATIONS; MOBILE HANDSETS; NEW PRODUCT INTRODUCTIONS; PORTABLE COMMUNICATIONS; SYSTEM IN A PACKAGES; WAFER LEVEL PACKAGE;

CHIP SCALE PACKAGES;

EID: 0009598679     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906416     Document Type: Conference Paper

References (7)

1. Circuits Assembly, May 2000, p. 22.
2. BGA/CSP Development Update Service, TechSearch International, Inc., January 2000, p. 3.
3. Koji Miyata, et al., "Stacked CSP (Chip Size Package) Technology", International Packaging Strategy Symposium (IPSS) 98, December 3, 1998, p. 51.
4. E. Jan Vardaman and Doug Feicht, "Wafer Level Packaging: The New Era for CSPs," ChipMOS Private Seminar, Taiwan, October 27, 2000.
5. E. Jan Vardaman, "Wafer Level Packaging: A New Market Trend for CSPs," 2000 IEMT/IMC Symposium, April 19-20, 2000, pp. 230-232.
6. Nobuyuki Sadakata, T. Suzuki, M.M. Inaba, M.I. Inaba, "A Wafer-Level Chip Scale Package Build Up with A Metal-Covered Polyimide Post," Denver High Density Interconnect Conference, April 2000, pp. 123-127.
7. Paul Hoffman, "System in Package," HDI Conference Proceedings, Phoenix, Arizona, September 25-27, 2000, p. 259.