Revisit of life-prediction model for solder joints

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1064-1069

  Anderson, T ^a   Barut, A ^a   Guven, I ^a   Madenci, E ^a  

^a UNIVERSITY OF ARIZONA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CURVE FITTING; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; LIFE CYCLE; MATHEMATICAL MODELS;

LIFE PREDICTION MODEL; PLASTIC WORK DENSITY;

SOLDERED JOINTS;

EID: 0034480258     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)