Effect of H2O partial pressure and temperature during Ti sputtering on texture and electromigration in AlSiCu/Ti/TiN/Ti metallization

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 16, Issue 5, 1998, Pages 2751-2758

  Yoshida, Tomoyuki ^a   Hashimoto, Shoji ^a   Mitsushima, Yasuichi ^a   Ohwaki, Takeshi ^a   Taga, Yasunori ^a  

^a Rd Management Section   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 11744365178     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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