Electromigration threshold for Cu/low k interconnects

Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003

Volumn , Issue , 2003, Pages 259-261

  Lee, Ki Don ^a   Ogawa, E T ^a   Yoon, S ^a   Lu, Xia ^a   Ho, P S ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

Dielectric materials; Electromigration; Life testing; Logic testing; Packaging; Performance evaluation; Polymers; Temperature; Thermal stresses; Thermomechanical processes

Indexed keywords

ACTIVATION ENERGY; DIELECTRIC MATERIALS; ELECTROMIGRATION; MATERIALS TESTING; ORGANIC POLYMERS; PACKAGING; PACKAGING MATERIALS; POLYMERS; TEMPERATURE; TEMPERATURE DISTRIBUTION; THERMAL STRESS;

CONFINEMENT EFFECTS; CU/LOW-K INTERCONNECTS; LIFE-TESTING; LOGIC TESTING; PERFORMANCE EVALUATION; POLYMER DIELECTRICS; TEMPERATURE DEPENDENCE; THERMOMECHANICAL PROCESS;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 1142272041     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2003.1219770     Document Type: Conference Paper

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