WL-CSP reliability with various solder alloys and die thicknesses

Microelectronics Reliability

Volumn 44, Issue 3, 2004, Pages 521-531

  Keser, Beth ^a   Wetz, Li ^a   White, Jerry ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COMPUTER SIMULATION; DIELECTRIC MATERIALS; DRY ETCHING; ELECTRONICS PACKAGING; MICROCRACKS; PLASMA ETCHING; SOLDERING; THERMAL EXPANSION; TIN COMPOUNDS;

DAMAGE FREE SURFACE; PACKAGE GEOMETRY;

SILICON WAFERS;

EID: 1142263931     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00220-8     Document Type: Article

References (9)

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