Effect of variation of microstructure on the creep and rupture strengths of a Sn-3.5% Ag lead-free solder alloy

Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques

Volumn 95, Issue 3, 2004, Pages 185-188

  Wu, Kepeng ^a   Wade, Noboru ^b   Yamada, Seiji ^b   Miyahara, Kazuya ^a  

^a NAGOYA UNIVERSITY   (Japan)

^b Topy Industries Limited   (Japan)

Author keywords

Creep rupture strength; Lead free solder alloy; Microstructural effect; Sn 3.5 Ag alloy

Indexed keywords

CASTING; COOLING; CREEP; ENERGY DISPERSIVE SPECTROSCOPY; GRAIN BOUNDARIES; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SILVER; SOLIDIFICATION; TIN; X RAY DIFFRACTION ANALYSIS;

CREEP-RUPTURE STRENGTH; LEAD-FREE SOLDER ALLOY; MICROSTRUCTURAL EFFECT; SN-3.5;

SOLDERING ALLOYS;

EID: 11344259450     PISSN: 00443093     EISSN: None     Source Type: Journal    
DOI: 10.3139/146.017933     Document Type: Article

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