Kinetics of copper electrodeposition in the presence of triethyl-benzyl ammonium chloride

Journal of Applied Electrochemistry

Volumn 33, Issue 8, 2003, Pages 685-692

  Varvara, S ^a   Muresan, L ^a   Popescu, I C ^a   Maurin, G ^b  

^a BABE BOLYAI UNIVERSITY   (Romania)

^b SORBONNE UNIVERSITÉ   (France)

Author keywords

Additives; Copper electrodeposition; Electrochemical impedance; Triethyl benzyl ammonium chloride

Indexed keywords

ADSORPTION; CHLORINE COMPOUNDS; COMPUTER SIMULATION; COPPER; HYDRODYNAMICS; MATHEMATICAL MODELS; MORPHOLOGY; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY; SPECTROSCOPY; X RAY DIFFRACTION ANALYSIS;

HYDRODYNAMIC VOLTAMMETRY; SULPHATE ACIDIC ELECTROLYTES; TRIETHYL BENZYL AMMONIUM CHLORIDE;

ELECTRODEPOSITION;

EID: 0042238323     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1025069004355     Document Type: Article

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