Gauge repeatability & reproducibility study for a 3-D solder paste inspection system

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3906, Issue , 1999, Pages 532-537

  Pan, Jianbiao ^a   Tonkay, Gregory L ^a   Storer, Robert H ^a   Sallade, Ronald M ^a   Leandri, David J ^a  

^a LEHIGH UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOBILE ELECTRONIC EQUIPMENT; INSPECTION; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT DESIGN; SPATIAL VARIABLES MEASUREMENT;

BALL GRID ARRAY; QUAD FLAT PACKAGES; SOLDER PASTE INSPECTION;

ELECTRONICS PACKAGING;

EID: 0033308566     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)