Study of the aperture filling process in solder paste stencil printing

American Society of Mechanical Engineers, Design Engineering Division (Publication) DE

Volumn 104, Issue , 1999, Pages 75-82

  Pan, Jianbiao ^a   Tonkay, Gregory L ^a  

^a Lehigh University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT DESIGN; SOLDERING; SURFACE MOUNT TECHNOLOGY;

APERTURE FILLING PROCESS; BALL GRID ARRAY; FLIP CHIP ON BOARD; SOLDER DEPOSITION; SOLDER PASTE STENCIL PRINTING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0033296231     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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