Stencil design for advanced packages

SMT Surface Mount Technology Magazine

Volumn 10, Issue 6, 1996, Pages 34-37

  Coleman, William E ^a  

^a Photo Stencil   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ASPECT RATIO; ELECTRONICS PACKAGING; ETCHING; FLIP CHIP DEVICES; LASER BEAM CUTTING; MASKS; PERFORMANCE; PRINTED CIRCUIT BOARDS; SOLDERING ALLOYS; THICK FILM DEVICES;

BALL GRID ARRAYS; CHEMICAL ETCHING; HYBRID STENCIL; STENCIL PRINTING; SURFACE MOUNT ADHESIVES; SURFACE MOUNT DEVICES;

SURFACE MOUNT TECHNOLOGY;

EID: 0030164241     PISSN: 15298930     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (9)

1. J.S. Hwang, "Ball Grid Array and Fine Pitch Peripheral Interconnections," Electrochemical Publication LTD (1995).
2. D. Kopp, P. Zarrow, "Step-by-Step: Part 4 - Printing," Surface Mount Technology, p. 60, April 1995.
3. M. Curtin, "Fine-Pitch Stencil Printing: Failure Modes and Recent Advances," Proceedings of Surface Mount International 1990 Exposition and Conference, p. 716.
4. W. Coleman, R. Myklak, "The Design and Manufacture of Metal-Mask Stencils - Meeting the Challenge of Fine Pitch Technology," Surface Mount Technology, p. 26, May 1990.
5. W. Coleman, K. Aeschliman, "Stencil Printing: Application and Stencil Design Guides," Proceedings of Surface Mount International 1994, p.492.
6. T. Gervascio, "Developing the Paste-In-Hole Process," Proceedings of Surface Mount International 1994, p.333.
7. R. Rowland R., "Screen Printing Surface Mount Adhesives," Proceedings of the Technical Program NEPCON West 1990, p.791.
8. R. Pratt, "Strategies for Eliminating Solder Micro-ball Formation During No-Clean Assembly," Proceedings of Surface Mount International 1995, p 677.
9. L.F. Miller, "Controlled Collapse Reflow Chip Joining," IBM Journal of Research and Development, Vol 13, May 1969.