Loss due to transverse thermoelastic currents in microscale resonators

Materials Science and Engineering: A

Volumn 370, Issue 1-2, 2004, Pages 407-411

  Houston, B H ^a   Photiadis, D M ^a   Vignola, J F ^b   Marcus, M H ^a   Liu, Xiao ^b   Czaplewski, D ^c   Sekaric, L ^c   Butler, J ^a   Pehrsson, P ^a   Bucaro, J A ^a  

^a NAVAL RESEARCH LABORATORY   (United States)

^b SFA INC   (United States)

^c Department of Obstetrics Gynecology   (United States)

Author keywords

Mechanical oscillator; Microelectromechanical system; Nanoelectromechanical system; Quality factor

Indexed keywords

BENDING MOMENTS; DAMPING; DIAMONDS; DIFFUSION; ENERGY DISSIPATION; FRICTION METERS; MICROSTRUCTURE; OSCILLATORS (ELECTRONIC); SILICON; SINGLE CRYSTALS; THERMAL EFFECTS; THERMAL EXPANSION; THERMOELASTICITY; TORSIONAL STRESS;

FLEXURAL COMPONENT; MICROSCALE RESONATORS;

RESONATORS;

CURRENT;

EID: 11144356053     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2003.05.007     Document Type: Article

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