High Cu diffusion resistance in ultrathin multiquasi-amorphous CVD-Ti/TiNx films

Journal of the Electrochemical Society

Volumn 151, Issue 11, 2004, Pages

  Ou, Keng Liang ^a   Chiou, Shi Yung ^b   Lin, Ming Hong ^c  

^a TAIPEI MEDICAL UNIVERSITY   (Taiwan)

^b Department of Mold Engineering ^*

^c NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; MICROSTRUCTURE; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; THERMODYNAMIC STABILITY; THIN FILMS; TITANIUM COMPOUNDS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

MULTILAYER STRUCTURE; PLASMA TREATMENT; SHEET RESISTANCE; ULTRALARGE SCALE INTEGRATED (ULSI) DEVICES;

COPPER;

EID: 10944230958     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1801393     Document Type: Article

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